Use of Portable/In-Situ Stress-Strain Microprobe® System to Measure Stress-Strain Behavior and Damage in Metallic Materials and Structures
Haggag, F.M., Wang, J.A., Sokolov, M.A., and Murty, K.L., "Use of Portable/In-Situ Stress-Strain Microprobe® System to Measure Stress-Strain Behavior and Damage in Metallic Materials and Structures," Non-Traditional Methods of Sensing Stress, Strain and Damage in Materials and Structures, ASTM STP 1318, 1997, pp. 85–98.
This paper marks a pivotal transition in ABI® technology — from laboratory research instrument to portable, field-deployable commercial system. Published in ASTM STP 1318, the paper introduces the Stress-Strain Microprobe® (SSM®) system specifically designed for in-situ structural assessment.
The portable SSM® system described in this paper was engineered for field deployment on operating structures including pressure vessels, pipeline segments, and weld joints. Unlike the laboratory ABI® system, the portable SSM® incorporated a magnetic or mechanical mounting system for attachment to curved or inclined surfaces, a ruggedized enclosure for outdoor use, and battery-powered operation for remote sites.
The paper demonstrates the portable system's performance on multiple structural applications, showing that field measurements achieve the same accuracy as laboratory tests. This was a critical validation because the controlled conditions of a laboratory — flat specimen surfaces, precise alignment, temperature control — are absent in field applications where surfaces may be curved, rough, or at varying temperatures.
This publication effectively launched the commercial era of ABI® technology, transitioning it from a research curiosity to a practical engineering tool that could be deployed on operating infrastructure worldwide.